YI Ying

Editor:李洁Date:2023-11-30ClickTimes:


Personal Profile:

Yi Ying, professor, doctoral supervisor, CUG scholar – discipline leading talent, has been selected in the High-Level Talent Plan of Hubei Province, Wuhan Talent Plan, and “Hundred Talents Plan” of China University of Geosciences. In 2016, he graduated from the University of British Columbia, Canada with his doctorate. So far, he has published (in English) more than 50 academic papers, including 24 important SCI journal papers in the field of sensors, radio and signal processing (including 1 IEEE T BIO-MED ENG selected paper) and 9 important IEEE international conference papers (including 1 best conference paper award). He has edited one English monograph, obtained one US invention patent, co-chaired and participated in four overseas national research projects, given two invited presentations, and served as a reviewer for IEEE J MICROELECTROMECH S, IEEE WIREL COMMUN and IEEE SENS J.


Contact Information:

Office: Room 639, No. 2 Teaching Building

Email: yiying@cug.edu.cn


Research fields:

• Hardware: Multimodal flexible sensors for pressure, humidity, temperature, etc., with research content covering device design, performance testing, physical experimentation and application exploration.

• Software: Machine vision, artificial intelligence, data fusion, etc., with the research content covering theoretical research, mathematical derivation, computer simulation, etc.

Admissions:

The research group welcomes postgraduates and postdoctoral who love scientific research, study hard, and have the professional knowledge background in electronic information, microelectronics, precision instruments, automation or similar disciplines. In addition, the group welcomes outstanding senior undergraduate students to participate in our research work.


Major Overseas Education and Research Experience:

• 2019-2020: Visiting scholar at University of British Columbia, Canada

• 2018-2021: Senior research fellow at Hamad bin Khalifa University, Qatar

• 2016-2018: Postdoctoral fellow at University of British Columbia, Canada

• 2013-2013: Visiting student at Stanford University, USA

• 2012-2016: PhD at University of British Columbia, Canada

• 2010-2012: Project research fellow at Kyung Hee University, Korea

• 2008-2010: Master at Kyung Hee University, Korea


Main Honors:

2015: Chinese Government Award for Outstanding Self-financed Students Abroad (Canada), China Scholarship Council, China

2015-2016: Graduate Scholarship, University of British Columbia, Canada

2015: Entrance Scholarship, University of British Columbia, Canada

2012-2015: Scholarship of King Abdullah University of Science and Technology (KAUST), Saudi Arabia

2008-2010: Presidential Scholarship, Kyung Hee University, Korea


Selected Papers in Recent Three Years:

1. Yi, Y., Zhou, Z., Zhang, W., Zhou, M., Yuan, Y., and Li, C*., 2023. Fatigue Detection Algorithm Based on Eye Multifeature Fusion. IEEE Sensors Journal. 23(7): 7949-7955.

2. Yi, Y., Chiao, M., Mahmoud, K., and Wang, B*., 2023. An MXene-doped PVA/PVP hydrogel-based strain sensor applicable In liquid environment. Smart Materials and Structures, 32 (2): 025010.

3. Yi, Y., Zhang, H., Zhang, W., Yuan, Y., and Li, C*., 2023. Fatigue Working Detection Based on Facial Multifeature Fusion. IEEE Sensors Journal. 23(6): 5956-5961.

4. Yi, Y., Chiao, M. and Wang, B*., 2021. An electrochemically actuated drug delivery device with in-situ dosage sensing. Smart Materials and Structures, 30(5): p.055003.

5. Yi, Y., Chen, J. and Takahata, K*., 2020. Wirelessly powered resonant-heating stent system: Design, prototyping, and optimization. IEEE Transactions on Antennas and Propagation, 68(1): 482-490.

6. Yi, Y., Chen, J., Hsiang, Y. and Takahata, K*., 2019. Wirelessly heating stents via radiofrequency resonance toward enabling endovascular hyperthermia. Advanced Healthcare Materials, 8(22): p.1900708.

7. Yi, Y., Chen, J., Selvaraj, M., Hsiang, Y. and Takahata, K*., 2019. Wireless hyperthermia stent system for restenosis treatment and testing with swine model. IEEE Transactions on Biomedical Engineering, 67(4): 1097-1104.