Personal Profile
Bai Wei, male, PhD, professor, doctoral supervisor, “CUG Scholar” Young Top Talent, received his doctorate in mechanical and electronic engineering from Huazhong University of Science and Technology in 2018. From 2016 to 2018, he successively went to Loughborough University and the University of Tokyo for joint training and visiting scholar research. From 2019 to 2021, he was engaged in post-doctoral research in the School of Mechanical Science and Engineering of Huazhong University of Science and Technology. He joined the School of Mechanical Engineering and Electronic Information of China University of Geosciences in 2021, and is mainly engaged in the research on advanced manufacturing and robotics. In the past five years, he has presided over the sub-projects of the National Key R&D Program, National Natural Science Foundation of China for the Youth, the program supported by Special Fund of China Postdoctoral Science Foundation, general program of China Postdoctoral Science Foundation, and participated in the National 973 Program, the Special Project for High-Quality Development of the Ministry of Industry and Information Technology, and the Shenzhen Key Fundamental Research Project. He has published one chapter of a monograph in English and more than 20 papers in well-known journals at home and abroad, such as Int. J. Mach. Tool. Manu., Int. J. Mech. Sci., Ultrasonics, and Journal of Mechanical Engineering. He is a senior member of Chinese Mechanical Engineering Society, senior member of Chinese Society of Astronautics, senior member of Chinese Society of Biomedical Engineering, ASME member, IEEE member, member of China Society of Space Research, member of Intelligent Manufacturing Committee of Chinese Association for Artificial Intelligence, and review expert of NSFC. He is also the editor of Front. Manuf. Tech., and a reviewer of J. Manuf. Process., Journal of Mechanical Engineering and other domestic and international journals.
Contact Information
Office location: Room 623 (No. 2 Teaching Building), School of Mechanical Engineering and Electronic Information, China University of Geosciences
Email: wbai@cug.edu.cn
Research Fields
Research on advanced manufacturing and robotics research for aerospace and biomedical fields
Advanced manufacturing and special manufacturing: field-assisted precision manufacturing, ultrasound-assisted processes and equipment, biomanufacturing
Robotics and intelligent equipment: advanced robots, intelligent drilling and sampling equipment, high-performance medical equipment
Scientific Research Programs
National Natural Science Foundation of China for the Youth, No.52005199, under study, PI
Sub-project of National Key R&D Program, No.2020YFB1710400, under study, PI
General program of China Postdoctoral Science Foundation, No.2019M652629, concluded, PI
Program supported by Special Fund of China Postdoctoral Science Foundation, No.2019TQ0107, concluded, PI
Major State Basic Research Development Program of China (973 program), No.2013CB035805, concluded, participant
Special Project for High-Quality Development of the Ministry of Industry and Information Technology, No.TC200H021, under study, participant
Shenzhen Key Fundamental Research Project, No.JCYJ20200109150425085, under study, participant
Fund of The Engineering and Physical Sciences Research Council (EPSRC), EP/P027555/1, concluded, participant
Monograph
[1] W. Bai, R. Sun, J. Xu, V.V. Silberschmidt. Chapter 10: Microstructural Changes in Machining. Mechanics of Materials in Modern Manufacturing Methods and Processing Techniques. Elsevier. 2020. ISBN: 978-0-12-818232-1.
Papers
W. Bai, R. Sun, A. Roy, V. V. Silberschmidt. Improved analytical prediction of chip formation in orthogonal cutting of titanium alloy Ti6Al4V. International Journal of Mechanical Sciences. 2017, 133:357-367.
W. Bai, A. Roy, R. Sun, V. V. Silberschmidt. Enhanced machinability of SiC-reinforced metal-matrix composite with hybrid turning. Journal of Materials Processing Technology. 2019, 268:149-161.
W. Bai, A. Roy, L. Guo, J. Xu, V. V. Silberschmidt. Analytical prediction of frictional behaviour and shear angle in vibration-assisted cutting. Journal of Manufacturing Processes. 2021, 62:37-46.
W. Bai, K. Wang, D. Du, J. Zhang, W. Huang, J. Xu. Design of an ultrasonic elliptical vibration device with two stationary points for ultra-precision cutting. Ultrasonics. 2021, 106662.
W. Bai, R. Sun, J. Leopold, V. V. Silberschmidt. Microstructural evolution of Ti6Al4V in ultrasonically assisted cutting: Numerical modelling and experimental analysis. Ultrasonics. 2017, 78:70-82.
W. Bai, L. Shu, R. Sun, J. Xu, V. V. Silberschmidt, N. Sugita. Mechanism of material removal in orthogonal cutting of cortical bone. Journal of the Mechanical Behavior of Biomedical Materials. 2020, 103618
W. Bai, L. Shu, R. Sun, J. Xu, V. V. Silberschmidt, N. Sugita. Improvements of material removal in cortical bone via impact cutting method. Journal of the Mechanical Behavior of Biomedical Materials, 2020, 103791.
W. Bai, P. Pan, L. Shu, Y. Yang, J. Zhang, J. Xu, N. Sugita. Design of a self-centring drill bit for orthopaedic surgery: a systematic comparison of the drilling performance. Journal of the Mechanical Behavior of Biomedical Materials, 2021, 104727.
W. Bai, R. Sun, Y. Gao, J. Leopold. Analysis and modeling of force in orthogonal elliptical vibration cutting. International Journal of Advanced Manufacturing Technology. 2016, 83:1025-1036.
W. Bai, A. Bisht, A. Roy, S. Suwas, R. Sun, V. V. Silberschmidt. Improvements of machinability of aerospace-grade Inconel alloys with ultrasonically vibration assisted hybrid machining. International Journal of Advanced Manufacturing Technology. 2018, 101:1143-1156.
W. Bai, PAN Pengfei, SHU Liming, WANG Dong, ZHANG Jianguo, XU Jianfeng. Mechanism of Chip Formation and Crack Propagation in Ultrasonically Assisted Cutting of Bone Tissue. Journal of Mechanical Engineering. 2021, 57(11): 69-77.
Admission Information
We welcome outstanding students to join the research group. The group has long been working closely with scholars from the University of Tokyo, Loughborough University, University of Exeter, the Pennsylvania State University, the University of Hong Kong and other foreign institutions, and can recommend outstanding students for short-term training and joint training. In addition, we also maintain cooperation with aerospace (China Aerospace Science and Industry Corporation, China Aerospace Science and Technology Corporation, Aero Engine Corporation of China), shipping (CSIC), and biomedical (Mindray, United Imaging) companies, and can provide joint training.
